Molex’s Micro-Fit 3.0 interconnects offer users a low- to mid-range power-distribution solution with the highest current in the smallest footprint available today. Based on a 3.0mm centerline Micro-Fit 3.0 is available in wire-to-wire and wire-to-board configurations, SMT and through-hole processing, 2 to 24 circuits and single and dual row versions. Micro-Fit can be purchased in pure tin or one of two thicknesses of select gold to provide costs savings. Contacts are fully isolated on each side of the interface to eliminate potential arcing and incorporate four points of contact for redundancy. The housings utilize positive-lock features to prevent accidental disconnects. Micro-Fit interconnects are UL recognized, CSA approved and TUV licensed. All components are lead-free, RoHS compliant, halogen free and glow-wire compatible.
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