8105 -

Epoxy 4044; for Bonding SMT Components to a PWB; 4 FL.OZ. Jar; Printing Apps

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制造商：: Aim Aim
制造商產(chǎn)品編號(hào)：: 8105
倉(cāng)庫(kù)庫(kù)存編號(hào)：: 70054301
技術(shù)數(shù)據(jù)表：: Datasheet

訂購(gòu)熱線： 400-900-3095 0755-21000796, QQ:800152669, Email:sales@szcwdz.com

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8105產(chǎn)品概述

Recommended for printing applications, Epoxy 4044 is a single component, epoxy adhesive used for bonding SMT components to a PWB for double sided reflow or wave solder assembly. Epoxy 4044 has a formulated tolerance to shear-thinning, which is suitable for automated printing equipment and quick cure properties when exposed to heat. Viscosity and surface tension of Epoxy 4044 are adequate for use with high speed placement equipment.
Features

For Printing and Dispensing Applications

One Part Epoxy

Good For High Speed Placement Equipment

Fast Curing

Non-Stringing Formula

High Shear Strength

8105產(chǎn)品信息

8105關(guān)聯(lián)產(chǎn)品

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Aim
Epoxy 4044; for Bonding SMT Components to a PWB; 30CC Syringe; Printing Apps

型號(hào)：8120
倉(cāng)庫(kù)庫(kù)存編號(hào)：70054300
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Aim
ONE-STEP Underfill 688; 10 cc; No-Flow Underfill Flip Chip; CSP; BGA; and MICRO-BGA

型號(hào)：8111
倉(cāng)庫(kù)庫(kù)存編號(hào)：70054303
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8105相關(guān)搜索

郵箱：sales@szcwdz.com
Q Q：800152669
手機(jī)網(wǎng)站：m.szcwdz.com

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Boiling Point	>260°C
Brand/Series	8100 Series
Color	Yellow
Heat Deflection Temp	97°C
Odor	Aromatic (slightly)
Physical State	Solid (thick paste)
Specific Gravity	1.13 (wate = 1)
Tensile Strength	11500 psi
Viscosity	300-500 kcps
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